Engineering College Clean Room Located in IREAP

Equipment Available

Contact Persons: Jim O'Connor, (301) 405-5018, (joconnor at umd.edu), Jon Hummel, (301) 405-5017, (jhummel1 at umd.edu), or Tom Loughran, (301) 405-3642, (tcl at ece.umd.edu).

Photoresist spinners Chemical Hoods Profilometer Optical Microscopes Contact photolithography

Contact photolithography 2 3-target Sputter Deposition 3-target Sputter Deposition Reactive Ion Etcher Oxide and Poly Growth Furnace

Probe Station Ball Bonder Chemical-Mechanical Polisher E-beam Evaporator Wafer Bonder

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Photoresist Spinners (2) Photoresist spinners (2): Headway and Laurel	Chemical Hoods Four chemical hoods, two of which have hepa-filtered laminar flow, piranha, oxide (HF) and A1 etches normally set up or available	Profilometer Profilometer: Tencor Alphastep 500
Optical Microscopes Optical microscopes (2): Leitz Ergolux, one with 1 mm precision XYZ stage position readout	Contact photolithography Contact photolithography: commercial EVG620 aligner, 0.5 mm front side alignment accuracy, front-to-back alignment also, 1 mm alignment for wafer-to-wafer bonding	Contact photolithography 2 Contact photolithography: custom-made based on an Oriel Optical platform, very flexible (up to 6" wafers and 7" masks), normally set up for 4" wafers and 5" masks
3-target Sputter Deposition AJA Inc. RF and DC 3-target sputter deposition, up to 6" wafers, large variety of target materials available	Reactive Ion Etcher Trion reactive ion etcher (RIE) with load-lock. Normally run with CF4 or oxygen; chlorine and boron trichloride also available	Deep Reactive Ion Etcher STS deep reactive ion etcher (DRIE), for etching deep (100mm or more) trenches in silicon with high aspect ratio
Oxide and Poly Growth Furnace Oxide and poly growth furnace, single tube, 4" wafers (tubes are changed from oxide to poly growth). Another single-tube furnace available, donated by LPS but not yet installed.	Probe Station (not physically in clean room) Probe station: general characterization, set up for 1-V or C-V measurements	Ball Bonder (not physically in clean room) Ball bonder: set-up with gold wire
Chemical-Mechanical Polisher (not physically in clean room) Chemical-mechanical polisher: Strasbaugh CMP, 4" or 6" wafers	E-beam Evaporator (not physically in clean room) E-beam evaporator: Temescal model 1800, 4 hearth, most metals	Wafer Bonder Wafer bonder EVG501 - companion to aligner. Temperature up to 550oC; force up to 40 kN (9000 lbs)

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IREAP Homepage • Clean Room Homepage

Webpage maintained by Dorothea F. Brosius
Created 12/04/03 by DFB
Modified 09/22/05 by DFB